Phase Change Thermal Interface Materials
Feature
- Proprietary technology prevents excessive pump-out after initial burn-in cycle
- Naturally tacky and heat sink preheating or additional adhesive for attachment
- are generally not required
- Low thermal resistance at low pressures
- It is supplied the in rolls with a top tabbed liner for easy manual or large volume automated operations
Application
- High frequency microprocessors
- Notebook and desktop PCs
- Computer servers
- Thermal test stands
- DC/DC Convertors
- Memory modules
- Cache chips
- IGBTs
| Emei PN | Color | Thickness (inch) | Thermal Conductivity (W/m-K) | Phase Change Temperature Range(℃) | “Burn-in” Temperature (℃) | Thermal Impedance @ 10psi/50psi (℃-in2/W) | Temperature Range(℃) | Product Data Download (PDF Format) |
|---|---|---|---|---|---|---|---|---|
| E-Phase 800 | White | 0.005-0.02 | 2.5 | 50℃ | 75℃ for 5minutes | 0.088 ~ 0.123 | -40 ~ 130 | |
| E-Phase 7300 | Grey | 0.005-0.02 | 4.0 | 55℃ | 75℃ for 5minutes | 0.081 ~ 0.087 | -40 ~ 130 | |
| E-Phase 9100 | White | 0.01-0.02 | 1.0 | 50℃ – 65℃ | 75℃ for 5minutes | — | -40 ~ 130 |
Contact Us
Address
Unit 5, 3/F., Block A, New Trade Plaza,
6 On Ping Street, Shatin, N.T.,HK
- +852-2686 8168
- +852-2686 8268
- emeihk@emeigroup.com
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