Printed Circuit Board Assembly

  


 

 

 

 

Printed Circuit Board Assembly
Typical applications Products
- Potting
- Encapsulation
- Conformal coating
- Stencil
- Surface mount
- Thermally conductive
- One / two component epoxy adhesive
- Silicone / non-silicone based thermal conductive adhesive
- UV coating
- Surface mount adhesive
 

Model no

Description

Characteristic

Viscosity cPs

@25℃

Curing Condition

1102

Hot melt

UL 94V-0 certified, halogen and phosphorus free  

Available in rod / particle form

150-160℃ (melting point)

282A/B

Two component epoxy adhesive (Gray)

2W/mK good thermal conductivity, 1:1 mixing ratio, mixpac 

Paste

25℃ 24hrs or
65℃ 2hrs

286A/B

Two component epoxy adhesive (White)  

2W/mK good thermal conductivity, 1:1 mixing ratio, mixpac

paste

25℃ 24hrs or
65℃ 2hrs

400-58

Surface mount adhesive

Good adhesion, instant curing

200K-250K

120℃ 20mins

500-71

Conformal coating

Low temperature curing

50K-100K

60-70℃ 2hrs

500-71-1

Conformal coating

UV inspection

50K-100K

60-70℃ 2hrs














 

  
 
We provide Thermal Materials, EMI Shielding Materials, Polymer and Adhesives Materials, Insulation Materials, Inductive Components and Bulk Molding Compounds. Now, we are expanding to Building and Construction Materials.Our products gained quality certification and office networks in HK, Taiwan, Dongguan, Chengdu and Shanghai, Emei provides excellent value-added services including fabrication, adhesion, lamination, repackaging as well as 3 dimensions delivery & technical advice service in the Greater China.

more>>

Copyright 2005-2018 Emei (HK) Electronics Ltd. All rights reserved1