Printed Circuit Board Assembly

  


 

 

 

 

Printed Circuit Board Assembly
Main Applications Products
Conformal coating
-thermally conductive coating

-Hot melt adhesive
-One and two components epoxy systems
-Silicone and non silicone based heat sink compounds
-UV conformal coatings
-Electrically conductive inks (silver and carbon)
-Surface mount adhesive
 

Model no

Description

Characteristic

Viscosity cPs

@25℃

Curing Condition

1108

Hot melt

UL 94V-0, halogen free, phosphorus free

Rod or particle

150-160℃ (melting point)

2001A-4/600-9B

Two part potting epoxy

Slow flow, non-sag, fast cure

25K

25℃ 60 mins

286A/B

Two part potting epoxy

2W/mK ,1:1 mixing,
twin barrel packing, user friendly

paste

25℃ 24hrs or
65℃ 2hrs

400-58

Surface mount adhesive

good adhesion, fast curing

200K-250K

120℃ 20mins

500-71

Conformal coating

Low temperature curing

50K-100K

60-70℃ 2hrs

500-71-1

Conformal coating

UV tracable version

50K-100K

60-70℃ 2hrs














 

  
 
We provide Thermal Materials, EMI Shielding Materials, Polymer and Adhesives Materials, Insulation Materials, Inductive Components and Bulk Molding Compounds. Now, we are expanding to Building and Construction Materials.Our products gained quality certification and office networks in HK, Taiwan, Dongguan, Chengdu and Shanghai, Emei provides excellent value-added services including fabrication, adhesion, lamination, repackaging as well as 3 dimensions delivery & technical advice service in the Greater China.

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