|
Model no
|
Description
|
Characteristic
|
Viscosity cPs @25℃
|
Curing Condition
|
|
CI-1001
|
Conductive silver ink
|
High electrical conductivity
|
<0.015Ω/□.mil
|
120℃ 20mins
|
|
CI-1001B
|
Conductive silver ink
|
CI-1001 low cost version
|
<0.015Ω/□.mil
|
120℃ 20mins
|
|
CI-800
|
Conductive silver ink
|
High electrical conductivity, good adhesion
|
<0.012Ω/□.mil
|
120℃ 20mins
|
|
CI-801
|
Conductive silver ink
|
High electrical conductivity, fine printing resolution
|
<0.015Ω/□.mil
|
120℃ 20mins
|
|
CI-802
|
Conductive silver ink
|
Low temperature cure
|
<0.011Ω/□.mil
|
100℃ 30mins
|
|
CI-804
|
Conductive silver ink
|
For non-thermal resistant substrates e.g. PC
|
<0.011Ω/□.mil
|
120℃ 30mins
|
|
CI-3090C
|
Conductive silver ink
|
Higher electrical resistance，lower silver content
|
<0.025Ω/□.mil
|
120℃ 20mins
|
|
CI-1014
|
Conductive silver ink
|
Low temperature cure
|
<0.015Ω/□.mil
|
80℃ 60mins
|
|
CI-4001
|
Ag/AgCl ink
|
Medical Electrode printing
|
12K
|
150℃ 2mins
|
|
CI-2001
|
Conductive carbon ink
|
Abrasion resistance, for silver contacts protection
|
<20Ω/□.mil
|
110℃ 20mins
|
|
CI-2018
|
Conductive carbon ink
|
Zebra circuit application, fine resolution
|
<12Ω/□.mil
|
120℃ 30mins
|
|
CI-2018H
|
Conductive carbon ink
|
Low resistance, printed circuit application
|
<11Ω/□.mil
|
120℃ 30mins
|
|
CI-2018L
|
Conductive carbon ink
|
Low viscosity, mix with CI-2018H
|
<50Ω/□.mil
|
120℃ 30mins
|
|
CI-2002
|
Heater carbon ink
|
High temperature resistance, suitable for the printing of heated foils and carpets
|
<50Ω/□.mil
|
110℃ 20mins
|
|
CI-2022
|
heater carbon ink
|
High resistivity, for mixing with CI-2002
|
<20kΩ/□.mil
|
110℃ 20mins
|
|
DI-7502
|
UV cure dielectric ink
|
Good adhesion
|
>800V/mil
|
750mJ/cm²
|
|
DI-7502B
|
UV cure dielectric ink
|
Blue
|
>800V/mil
|
750mJ/cm²
|
|
DI-7502C
|
UV cure dielectric ink
|
Transparent
|
>800V/mil
|
750mJ/cm²
|
|
DI-7502LH
|
UV cure dielectric ink
|
Halogen free，light green color
|
>800V/mil
|
750mJ/cm²
|
|
D04-218
|
UV cure dielectric ink
|
Low Price
|
>800V/mil
|
750mJ/cm²
|
|
D04-218C
|
UV cure dielectric ink
|
Transparent
|
>800V/mil
|
750mJ/cm²
|
|
DI-7521
|
UV cure dielectric ink
|
High temperature and humidity resistance
|
>800V/mil
|
750mJ/cm²
|
|
D04-132
|
UV cure dielectric ink
|
High thickness, for space printing
|
>800V/mil
|
750mJ/cm²
|
|
DI-701
|
Heat cure dielectric ink
|
Low Price
|
>800V/mil
|
120℃ 20mins
|
|
DA-5100
|
LED DIE-ATTACH silver epoxy
|
High electric conductive, good for IC Bonding
|
Paste
|
130℃ 90mins
|
|
EC-9519
|
SMD LED encapsulant
|
Good adhesion to PET, high flexibility and high hardness
|
4000 cPs before cure
|
750mJ/cm²
|
|
DI-531
|
Peelable mask
|
Peelable mask for windows protection
|
35K-45K
|
130℃ 10mins
|
|
T-1001
|
solvent
|
Solvent for CI-1001, CI-1001B and CI-2018
|
|
|
|
T-1016
|
solvent
|
Solvent for CI-1016
|
|
|
|
T-1035
|
solvent
|
Solvent for CI-1035C
|
|
|
|
Outstanding Stability
EMS CI-1001 shows outstanding stability over Shanghai and China competitors. Please see the below for the conductivity change over time after curing:
|
.gif) |
|
|
