Membrane switch / FPC / RFID

 

Membrane switch / FPC / RFID
Main Applications Products
-FPC
-Membrane switch
-RFID printing
-Silver Ink
-Carbon Ink
-Dielectric
-Silver through hole (coming soon)
 

Model no

Description

Characteristic

Viscosity cPs @25

Curing Condition

CI-1001

Conductive silver ink

High electrical conductivity

<0.015Ω/□.mil

120℃ 20mins

CI-1001B

Conductive silver ink

CI-1001 low cost version

<0.015Ω/□.mil

120℃ 20mins

CI-800

Conductive silver ink

High electrical conductivity, good adhesion

<0.012Ω/□.mil

120℃ 20mins

CI-801

Conductive silver ink

High electrical conductivity, fine printing resolution

<0.015Ω/□.mil

120℃ 20mins

CI-802

Conductive silver ink

Low temperature cure

<0.011Ω/□.mil

100℃ 30mins

CI-804

Conductive silver ink

For non-thermal resistant substrates e.g. PC

<0.011Ω/□.mil

120℃ 30mins

CI-3090C

Conductive silver ink

Higher electrical resistance,lower silver content

<0.025Ω/□.mil

120℃ 20mins

CI-1014

Conductive silver ink

Low temperature cure

<0.015Ω/□.mil

80℃ 60mins

CI-4001

Ag/AgCl ink

Medical Electrode printing

12K

150℃ 2mins

CI-2001

Conductive carbon ink

Abrasion resistance, for silver contacts protection

<20Ω/□.mil

110℃ 20mins

CI-2018

Conductive carbon ink

Zebra circuit application, fine resolution

<12Ω/□.mil

120℃ 30mins

CI-2018H

Conductive carbon ink

Low resistance, printed circuit application

<11Ω/□.mil

120℃ 30mins

CI-2018L

Conductive carbon ink

Low viscosity, mix with CI-2018H

<50Ω/□.mil

120℃ 30mins

CI-2002

Heater carbon ink

High temperature resistance, suitable for the printing of heated foils and carpets

<50Ω/□.mil

110℃ 20mins

CI-2022

heater carbon ink

High resistivity, for mixing with CI-2002

<20kΩ/□.mil

110℃ 20mins

DI-7502

UV cure dielectric ink

Good adhesion

>800V/mil

750mJ/cm²

DI-7502B

UV cure dielectric ink

Blue

>800V/mil

750mJ/cm²

DI-7502C

UV cure dielectric ink

Transparent

>800V/mil

750mJ/cm²

DI-7502LH

UV cure dielectric ink

Halogen free,light green color

>800V/mil

750mJ/cm²

D04-218

UV cure dielectric ink

Low Price

>800V/mil

750mJ/cm²

D04-218C

UV cure dielectric ink

Transparent

>800V/mil

750mJ/cm²

DI-7521

UV cure dielectric ink

High temperature and humidity resistance

>800V/mil

750mJ/cm²

D04-132

UV cure dielectric ink

High thickness, for space printing

>800V/mil

750mJ/cm²

DI-701

Heat cure dielectric ink

Low Price

>800V/mil

120℃ 20mins

DA-5100

LED DIE-ATTACH silver epoxy

High electric conductive, good for IC Bonding

Paste

130℃ 90mins

EC-9519

SMD LED encapsulant

Good adhesion to PET, high flexibility and high hardness

4000 cPs before cure

750mJ/cm²

DI-531

Peelable mask

Peelable mask for windows protection

35K-45K

130℃ 10mins

T-1001

solvent

Solvent for CI-1001, CI-1001B and CI-2018

 

 

T-1016

solvent

Solvent for CI-1016

 

 

T-1035

solvent

Solvent for CI-1035C

 

 

Outstanding Stability

EMS CI-1001 shows outstanding stability over Shanghai and China competitors. Please see the below for the conductivity change over time after curing:











 

We provide Thermal Materials, EMI Shielding Materials, Polymer and Adhesives Materials, Insulation Materials, Inductive Components and Bulk Molding Compounds. Now, we are expanding to Building and Construction Materials.Our products gained quality certification and office networks in HK, Taiwan, Dongguan, Chengdu and Shanghai, Emei provides excellent value-added services including fabrication, adhesion, lamination, repackaging as well as 3 dimensions delivery & technical advice service in the Greater China.

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