|
Model no
|
Description
|
Characteristic
|
Viscosity cPs @25℃
|
Curing Condition
|
|
CI-1001
|
Conductive silver ink
|
High conductivity
|
<0.015Ω/□.mil
|
120℃ 20mins
|
|
CI-1001B
|
Conductive silver ink
|
High conductivity, low cost
|
<0.015Ω/□.mil
|
120℃ 20mins
|
|
CI-1036 |
Conductive silver ink
|
Very high conductivity, good flexibility and stretchable |
<0.010Ω/□.mil
|
110℃ 20mins |
|
CI-1075 |
Conductive silver ink |
Good flexibility and elongation for IMD applications |
<0.010Ω/□.mil
|
120℃ 10mins |
|
CI-1088 |
Conductive silver ink |
Low temperature curing |
<0.025Ω/□.mil |
50℃ 10mins |
|
CI-800
|
Conductive silver ink
|
High conductivity, good flexibility, good adhesion
|
<0.015Ω/□.mil
|
120℃ 30mins
|
|
CI-801
|
Conductive silver ink
|
Very high conductivity, fine line printing
|
<0.009Ω/□.mil
|
130℃ 30mins
|
|
CI-804
|
Conductive silver ink
|
For PC antenna printing
|
<0.010Ω/□.mil
|
120℃ 30mins
|
|
CI-2001
|
Conductive carbon ink
|
Abrasion resistance, for silver contacts
|
<20Ω/□.mil
|
110℃ 20mins
|
|
CI-2001XL |
Conductive carbon ink |
Low viscosity for using with CI-2001 |
Not to be used alone |
110℃ 20mins |
|
CI-2018
|
Conductive carbon ink
|
Fine line printing for zebra connectors
|
<12Ω/□.mil
|
120℃ 30mins
|
|
CI-2018H
|
Conductive carbon ink
|
High viscosity, low resistance, for PCB
|
<11Ω/□.mil
|
120℃ 30mins
|
|
CI-2018L
|
Conductive carbon ink
|
Low viscosity for using with CI-2018H
|
<50Ω/□.mil
|
120℃ 30mins
|
|
CI-2002
|
Conductive carbon ink for heater
|
For heater application, temperature resistant
|
<50Ω/□.mil
|
110℃ 20mins
|
|
CI-2022
|
Conductive carbon ink for heater
|
High electrical resistance, use with CI-2002
|
<20kΩ/□.mil
|
110℃ 20mins
|
|
CI-2050 |
Conductive carbon ink |
Pressure sensitive carbon ink |
<22Ω/□.mil |
110℃ 10mins |
|
CI-2051 |
Conductive carbon ink |
Stretchable carbon ink |
<50Ω/□.mil |
90℃ 5mins |
|
CI-2062 |
Conductive carbon ink |
Positive temperature coefficient carbon ink |
<50Ω/□.mil |
90℃ 5mins |
|
CB-F1023 |
Conductive carbon ink |
For ITO connection in LCD |
<15Ω/□.mil |
80℃ 15mins |
|
DI-7502
|
UV curing dielectric
|
General purpose UV dielectric
|
>800V/mil
|
750mJ/cm²
|
|
DI-7502B
|
UV curing dielectric
|
Blue version of DI-7502
|
>800V/mil
|
750mJ/cm²
|
|
DI-7502C
|
UV curing dielectric
|
Clear version of DI-7502
|
>800V/mil
|
750mJ/cm²
|
|
DI-7502LH
|
UV curing dielectric
|
Halogen free, light green version of DI-7502
|
>800V/mil
|
750mJ/cm²
|
|
DI-702 |
UV curing dielectric |
Low cost dielectric for general purposes |
>800V/mil |
750mJ/cm² |
|
DI-702C |
UV curing dielectric |
Clear version of DI-702 |
>800V/mil |
750mJ/cm² |
|
DI-7544 |
UV curing dielectric |
Resistant to high temperature and humidity |
>800V/mil |
750mJ/cm² |
|
D04-132
|
UV curing spacer
|
For space printing, high viscosity
|
>800V/mil
|
750mJ/cm²
|
|
DI-701
|
Heat curing dielectric, green
|
General purpose, heat curing
|
>800V/mil
|
130℃ 20mins
|
|
DI-701C |
Heat curing dielectric, clear |
Good adhesion to ITO, good compatibility with various silver inks |
>800V/mil |
130℃ 20mins |
|
DA-5100
|
LED surface mount silver epoxy
|
Very good adhesion
|
<0.0006 Ω.cm
|
130℃ 90mins
|
|
EC-9519
|
LED encapsulant
|
UV curing, low stress, elastic
|
>800V/mil
|
750mJ/cm²
|
|
Outstanding Stability
EMS CI-1001 shows outstanding stability over Shanghai and China competitors. Please see the below for the conductivity change over time after curing:
|
.gif) |
|
|
