Micro-electronic Material

 

Micro-electronic Material
Typical applications Products
- COB bonding
- Thermally conductive
- Sealing
- Under-fill
- Semi-conductor package
- Conductive epoxy
- One / two component epoxy adhesive
- One component silicone
 

Model no

Description

Characteristic

Viscosity cPs @25

Curing Condition

275-55

Under-fill

Fast curing, reworkable

4K-6K

120℃ 3-4mins

400-58

Surface Mount adhesive

Strong adhesion, instant curing

200K-250K

120℃ 20mins

400-58HF

Halogen free surface mount adhesive

Good adhesion, instant curing

250K-350K

120℃ 20mins

400-97

COB bonding

Good flow, low profile

40K-60K

125℃ 60mins

408-14

COB bonding

Resistance to high temperature and humidity, survive reflow

45K-55K

120℃ 30mins

DA-5100

Die attach conductive epoxy

Good electrical conductivity

Paste

150℃ 30mins

EN-7830

Premium grade COB bonding

Resistance to high temperature and humidity, survive reflow and pressure cooker test

65K-90K

150℃ 30mins

EB-7408

COB bonding

Low temperature curing, good stability upon storage

40K-50K

120℃ 30mins














 

We provide Thermal Materials, EMI Shielding Materials, Polymer and Adhesives Materials, Insulation Materials, Inductive Components and Bulk Molding Compounds. Now, we are expanding to Building and Construction Materials.Our products gained quality certification and office networks in HK, Taiwan, Dongguan, Chengdu and Shanghai, Emei provides excellent value-added services including fabrication, adhesion, lamination, repackaging as well as 3 dimensions delivery & technical advice service in the Greater China.

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