Micro-electronic Material

 

Micro-electronic Material
Main Applications Products
-COB adhesive
-thermally conductive sealnt
-Underfill
-Phase change
-One component epoxy
-Two components epoxy
-One component silicone
-Chip scale elastomers
 

Model no

Description

Characteristic

Viscosity cPs @25

Curing Condition

275-55

Underfill

Fast cure, good reworkability

4K-6K

120℃ 3-4mins

400-58

Surface Mount adhesive

Fast cure

200K-250K

120℃ 20mins

400-58HF

Halogen Free SMA

SMA, fast curing

250K-350K

120℃ 20mins

400-97

One part epoxy adhesive

Good flow property

40K-60K

125℃ 60mins

408-14

COB

Fast curing,stable

50K-60K

120℃ 30mins

DA-5100

Die-attach silver epoxy

High electric conductivity, good for IC Bonding

Paste

150℃ 30mins

EN-706

medium grade COB adhesive

Pass reflow and high temperature resistance, pass PCT test

50K-80K

150℃ 30mins

EN-7830

Premium grade COB adhesive

Pass PCT and high temperature resistance, high humidity testing

65K-90K

150℃ 30mins

Lord EP-37

COB

Halogen free

45K-55K

120℃ 30mins

EB-7408

COB

low temperature cure,stable

40K-50K

120℃ 30mins

MA-4508

Surface Mount adhesive

SMA, fast curing

200K-250K

120℃ 20mins














 

We provide Thermal Materials, EMI Shielding Materials, Polymer and Adhesives Materials, Insulation Materials, Inductive Components and Bulk Molding Compounds. Now, we are expanding to Building and Construction Materials.Our products gained quality certification and office networks in HK, Taiwan, Dongguan, Chengdu and Shanghai, Emei provides excellent value-added services including fabrication, adhesion, lamination, repackaging as well as 3 dimensions delivery & technical advice service in the Greater China.

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